When Removing Hazardous Substances from Electronic Components Makes Sense Technically and Economically
I first became aware of E-Certa in March of 2006. The idea of converting Pb-bearing parts to RoHS compliance was intriguing. Later, when I saw that a number of companies were applying for RoHS exemptions based on lifetime buys of Pb-containing parts, I thought that was odd given the E-Certa solution. This was clearly a case of "adaptation to scientific and technical progress" that was being ignored by the industry. This interview with Joel Deutsch explains the conversion process and how it can solve the lifetime buy dilemma.
RoHSwell.com: How exactly can E-Certa convert a non-compliant component to meet RoHS compliance standards?
Joel Deutsch: First, the electronic component's external leads are processed back to their original pre-plated condition using New Way technology's patent pending procedure. Then, the leads are re-coated in a qualified alternative solder, using a robotic hot solder dip technique. This process mitigates the RoHS restricted substances contained in the component to a compliant level. Finally, XRF testing is used to confirm the compliant status of the component. This process has been researched and verified through destructive icp/ms testing.
RoHSwell: What steps are involved?
Joel: When products to be converted are received, they are tested to determine their original elemental content by use of a Fischer XRF XAN machine. We document and file the test results. Then, the product moves into the physical conversion process. Upon completion of the process, the now compliant components are brought back into the XRF testing lab for confirmation and documentation. The test results are sent to a client-password-protected area of E-Certa's website for easy access should the client be audited by governing parties. Finally, a material declarations document is delivered to the client to meet due diligence requirements set forth by the EU RoHS Directive.
RoHSwell: What can be done to ease the end of life availability concerns for Pb-containing components?
Joel: With E-Certa's robotic hot solder dip technique, the conversion from no lead to tin/lead solder is a viable option. Requirements for this service from RoHS exempted industries-such as medical, military/aerospace, and network infrastructure-are mounting, stemming from problems with discontinued parts, long-lead times, price premium parts, and Pb free replacements with higher percentages of tin. Managers in these industries are concerned with temperature compatibility issues in the soldering environment and the risk of tin whiskering. When these companies need to get their parts converted from Pb free to Pb, material content confirmation is critical to them.
RoHSwell: What implications does your process have for tin-whisker mitigation?
Joel: Our conversion process employs techniques found to reduce the occurrence of tin whiskers that have been researched by groups such as iNEMI. In the iNEMI document "Recommendations on Lead-Free Finishes for Components used for High Reliability Products" version 3, researchers state that "Hot dipping with SnAg4 or SnAgCu is generally an effective mitigation practice." Also found in the iNEMI research is that "Annealing/heat treating (150 degrees C for 1 hour) of matte tin-plated copper alloy lead frames has shown promise as a tin whisker mitigation technique." However, they state that the data is still not at a level to which the User Group is ready to provide this technique with a blanket endorsement. These are currently the most applicable tin whisker mitigation techniques being researched and used today. E-Certa applies both of these practices in our conversion process to address tin whisker mitigation. We are continually monitoring research to mitigate and manage the risk of tin whiskering.
